? 2016 littelfuse, inc. specifcations are subject to change without notice. revised: 12/29/16 description applications the bidirectional sphv-c series is designed for use in portable applications, led lighting modules, automotive applications, and low speed i/os. it will protect sensitive equipment from damage due to electrostatic discharge (esd) and other overvoltage transients. the sphv-c series can safely absorb repetitive esd strikes above the maximum level of the iec 61000- 4-2 international standard (level 4, ?8kv contact discharge) ?without performance degradation and safely dissipate up to 8a (sphv12-c) of induced surge current (iec 61000-4-5, 2nd edition t p =8/20s) with very low clamping voltages. features sphv-c series 200w discrete bidirectional tvs diode pinout functional block diagram life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. 1 2 ? led lighting modules ? portable instrumentation ? general purpose i/o ? mobile & handhelds ? rs232 / rs485 ? can and lin bus rohs pb green ? esd, iec 61000-4-2, 30kv contact, 30kv air ? eft, iec 61000-4-4, 40a (5/50ns) ? lightning, iec 61000- 4-5 2nd edition, 8a (t p =8/20s, sphv12-c) ? low clamping voltage ? low leakage current ? small sod882 packaging helps save board space ? aec-q101 qualifed ? lead-free and rohs compliant ? side exposed leadframe helps to verify solderability (sphvxx- ktg-c series) additional information datasheet samples esores tvs diode arrays (spa ? diodes) general purpose esd protection - sphv-c series
? 2016 littelfuse, inc. specifcations are subject to change without notice. revised: 12/29/16 notes: caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifcation is not implied. absolute maximum ratings symbol parameter value units p pk peak pulse power (t p =8/20s) 200 w t op operating temperature -40 to 125 c t stor storage temperature -55 to 150 c thermal information parameter rating units storage temperature range -55 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 20-40s) 260 c sphv12-c electrical characteristics (t op =25oc) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 12.0 v reverse breakdown voltage v br i r =1ma 13.3 v leakage current i leak v r =12v 1. 0 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 19.0 v i pp =8a, t p =8/20s, fwd 25.0 v dynamic resistance 2 r dyn tlp, t p =100ns, i/o to gnd 0.48 ? peak pulse current i pp t p =8/20s 8.0 a esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 30 kv iec61000-4-2 (air discharge) 30 kv diode capacitance 1 c d-gnd reverse bias=0v, f=1mhz 30 pf sphv15-c electrical characteristics (t op =25oc) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 15.0 v reverse breakdown voltage v br i r =1ma 16.7 v leakage current i leak v r =15v 1. 0 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 22.0 v i pp =5a, t p =8/20s, fwd 30.0 v dynamic resistance 2 r dyn tlp, t p =100ns, i/o to gnd 0.43 ? peak pulse current i pp t p =8/20s 5.0 a esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 30 kv iec61000-4-2 (air discharge) 30 kv diode capacitance 1 c i/o-gnd reverse bias=0v, f=1mhz 24 pf note: 1 parameter is guaranteed by design and/or device characterization. 2 transmission line pulse (tlp) with 100ns width and 200ps rise time. note: 1 parameter is guaranteed by design and/or device characterization. 2 transmission line pulse (tlp) with 100ns width and 200ps rise time. tvs diode arrays (spa ? diodes) general purpose esd protection - sphv-c series
? 2016 littelfuse, inc. specifcations are subject to change without notice. revised: 12/29/16 sphv24-c electrical characteristics (t op =25oc) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 24.0 v reverse breakdown voltage v br i r =1ma 26.7 v leakage current i leak v r =24v 1. 0 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 36.0 v i pp =3a, t p =8/20s, fwd 50.0 v dynamic resistance 2 r dyn tlp, t p =100ns, i/o to gnd 0.65 ? peak pulse current i pp t p =8/20s 3.0 a esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 24 kv iec61000-4-2 (air discharge) 30 kv diode capacitance 1 c i/o-gnd reverse bias=0v, f=1mhz 17 pf sphv36-c electrical characteristics (t op =25oc) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 36.0 v reverse breakdown voltage v br i r =1ma 40.0 v leakage current i leak v r =36v 1. 0 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 52.0 v i pp =2a, t p =8/20s, fwd 65.0 v dynamic resistance 2 r dyn tlp, t p =100ns, i/o to gnd 1.33 ? peak pulse current i pp t p =8/20s 2.0 a esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 15 kv iec61000-4-2 (air discharge) 20 kv diode capacitance 1 c i/o-gnd reverse bias=0v, f=1mhz 13 pf non-repetitive peak pulse power vs. pulse time pu ls e du ra ti on - t p ( s) p eak pu l se po we r - p pk (k w) 0.01 0. 1 1 10 0. 11 10 100 1000 note: 1 parameter is guaranteed by design and/or device characterization. 2 transmission line pulse (tlp) with 100ns width and 200ps rise time. note: 1 parameter is guaranteed by design and/or device characterization. 2 transmission line pulse (tlp) with 100ns width and 200ps rise time. power derating curve 0 10 20 30 40 50 60 70 80 90 100 110 02 55 07 51 00 12 51 50 am bi en t te mp er at ur e - t a ( o c) % of ra ted po we r i pp tvs diode arrays (spa ? diodes) general purpose esd protection - sphv-c series
? 2016 littelfuse, inc. specifcations are subject to change without notice. revised: 12/29/16 8/20s pulse waveform 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 time (s) percent of i pp 0 2 4 6 8 10 12 14 16 18 20 05 10 15 20 25 30 tl p vo lt ag e (v ) tl p cu rre nt (a ) sphv12-c transmission line pulsing(tlp) plot 0 2 4 6 8 10 12 14 16 18 20 05 10 15 20 25 30 35 tl p vo lt ag e (v ) tl p cu rre nt (a ) sphv15-c transmission line pulsing(tlp) plot 0 2 4 6 8 10 12 14 16 18 20 05 10 15 20 25 30 35 40 45 50 55 tl p vo lt ag e (v ) tl p cu rre nt (a ) sphv24-c transmission line pulsing(tlp) plot sphv36-c transmission line pulsing(tlp) plot 0 2 4 6 8 10 12 14 16 01 02 03 04 05 06 07 08 09 0 100 tl p vo lt ag e (v ) tl p cu rr en t (a ) tvs diode arrays (spa ? diodes) general purpose esd protection - sphv-c series
? 2016 littelfuse, inc. specifcations are subject to change without notice. revised: 12/29/16 ti me te mperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zo n e t l to t p refow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max refow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 260 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters ordering information product characteristics lead plating pre-plated frame lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) substitute material silicon body material molded epoxy, rated ul 94 v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold fash & metal burr. 4. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. package surface matte fnish vdi 11-13. part number package marking min. order qty. sphv12-01etg-c sod882 b2 10000 sphv15-01etg-c b5 sphv24-01etg-c b4 sphv36-01etg-c b6 SPHV12-01KTG-C sod882 with side exposed leadframe b2 10000 sphv15-01ktg-c b5 sphv24-01ktg-c b4 sphv36-01ktg-c b6 part numbering system part marking system sphv ** 01 t g voltage number of channels package t= tape & reel g= green ? tvs diode arrays (spa ? diodes ) e: sod882 x ? c bidirectional k: sod882 with side exposed leadframe b * 2: sphv1 2-c 5: sphv1 5-c 4: sphv24-c 6: sphv36-c 12 tvs diode arrays (spa ? diodes) general purpose esd protection - sphv-c series
? 2016 littelfuse, inc. specifcations are subject to change without notice. revised: 12/29/16 embossed carrier tape & reel specifcation f eeding direction t op mark and pin 1 direction in t ape and r eel bx 1 2 package dimensions ? sod882(sphvxx-01etg-c) recommended soldering pad layout (unit:mm) 0.30mm 0.45mm 1.20mm 0.70mm symbol package sod882 jedec mo-236 millimeters inches min typ max min typ max a 0.90 1. 0 0 1. 10 0.037 0.039 0.041 b 0.50 0.60 0.70 0.022 0.024 0.026 c 0.40 0.50 0.60 0.016 0.020 0.024 d 0.45 0.018 e 0.20 0.25 0.35 0.008 0.010 0.012 f 0.45 0.50 0.55 0.018 0.020 0.022 symbol millimeters a 0.70+/-0.045 b 1.10+/-0.045 c 0.65+/-0.045 d 1.55+/-0.10 e 1.75+/-0.05 f 3.50+/-0.05 p 2.00+/-0.10 p0 4.00+/-0.10 p1 2.00+/-0.10 w 8.00 + 0.30 -0.10 package dimensions sod882 with side exposed leadframe(sphvxx-01ktg-c) a b c i e g f h d d c a b side exposed l eadframe side vie w to p vie w bo t tom vie w 0.28 0.1 4 0.075 recommended soldering pad layout (unit:mm) 0.30mm 0.45mm 1.20mm 0.70mm *some etg packaging will look like ktg packaging due to the differing package construction between various suppliers. symbol package sod882 with side exposed leadframe jedec mo-236 millimeters inches min ty p max min ty p max a 0.90 1. 0 0 1. 10 0.037 0.039 0.043 b 0.50 0.60 0.70 0.020 0.024 0.028 c 0.90 1. 0 0 1. 10 0.037 0.039 0.043 d 0.55 0.65 0.75 0.022 0.026 0.030 e 0.40 0.50 0.60 0.016 0.020 0.024 f 0.50 0.60 0.70 0.020 0.024 0.028 g 0.20 0.25 0.30 0.008 0.010 0.012 h 0.40 0.50 0.60 0.016 0.020 0.024 i 0.05 max 0.002 max a - 0.14 - - 0.006 - b - 0.05 - - 0.002 - c - 0.075 - - 0.003 - d - 0.10 - - 0.004 - tvs diode arrays (spa ? diodes) general purpose esd protection - sphv-c series
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